Laser micromachining is a very sophisticated and dynamic industry. Micromachining equipment is used primarily in medicine, in the manufacture of specialized tools and jewellery, or for milling electrical components or glass. Optimized micromachining workstations utilize nanosecond, picosecond, and femtosecond lasers, and in combination with advance beam guidance, achieve micrometer-scale precision.
Thanks to close cooperation with our partner’s laboratory, our engineers have extensive knowledge of micromachining processes. Manufacturing processes are tested for feasibility and equipment is fine-tuned for performance, giving our systems a unique position on the market. Our key know-how consists of extensive familiarity with processes such as ablation, drilling, cutting, engraving, or intra-volume marking.
- Fibre, Nd:YAG, Nd:YVO4 lasers from leading manufacturers such as Coherent, Ekspla, LightConversion, and Inolight
- 2-100 W lasers with 50 ps to 150 fs pulse duration
- Scanning or static head
- Square, homogeneous, or Gaussian beam
- Scanning head equipped with a telecentric lens with a 25×25 to 100×100 mm writing field
- Suspension frame and granite base
- Integrated optical analysis, triangulation measurement, or camera inspection of the final result
- Use of Aerotech or Hiwin external linear and rotational axes
- Turnkey solutions from Elas, 3D-Micromac, or WOP
- Metals: micro-marking
- Laser drilling of parts for photovoltaic and electronics manufacturing
- Ultra-short pulse laser micromachining
- Engraving of thin layers
- Engraving/marking/patterning of glass
- Silicon wafer cutting
- Tungsten carbide / Cermet ablation
- PET drilling / Selective ablation
- Quartz, SiC, sapphire, diamond, tungsten carbide, biological materials, biodegradable polymers, glass, most metals, ferroelectric ceramics, etc.